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CIS for AOI / Industrial

Configure the main parameters of your industrial CIS, including interface, usable width, resolution, line speed, working distance and illumination, to arrive at a preliminary technical configuration.

    Material to scan

    Select the material to be inspected. This choice helps to correctly orient optics, illumination, resolution and
    CIS configuration.

    Battery foil / Electrodes

    Paper, labels, cardboard / Narrow web

    Plastic film / Packaging

    Stamped metal

    Reflective Metal / Brushed / Aluminum

    Glass/Transparent materials

    Ceramics / Tiles

    Wood / Panels

    Fabric / Leather

    Wafer / Semiconductors

    PCB / Outline / Through-hole

    Other material

    Defect or characteristic to be detected

    Select the type of anomaly or feature you need to check. This choice helps you correctly define the resolution, illumination, working distance, and CIS configuration.

    Scratches / Engravings / Scoring

    Breaks / Cracks / Chips

    Cuts / Edge / Profile / Outline

    Holes/Through-holes / Buttonholes

    Particles / Dust / Contamination

    Dents / Abnormal findings

    Bubbles / Void / Delaminations

    Folds / Wrinkles / Deformations

    Misalignment / Mismatch / Position

    Graphic defects / Pattern / Print / Color

    OCR / Serial / Notch / Marking

    Dimensional measurement / Position / Feature presence

    Other

    Usable width to scan

    (Mandatory choice)

    This measurement defines the effective length of the scanning window acquired in a single pass. Standard models already cover large formats, such as 310, 650, 940, and 1500 mm, up to 6000 mm, allowing the entire product to be inspected without the need for multiple cameras. For non-standard requirements, custom configurations are available, developed based on the specific application.


    OR


    DPI (Dots Per Inch)

    (Mandatory choice)

    This unit indicates how many dots/pixels the sensor captures in one inch of length (1" = 25.4 mm).

    The higher the DPI value, the more detail can be detected; lower values ​​allow for faster line speeds.

    Keep in mind that the ideal resolution should be half the size of the error you are looking for.



    100 DPI
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    200 DPI
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    300 DPI
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    600 DPI
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    1200 DPI
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    CIS Speed

    Indicates the feed rate of the material or workpiece into the scanning area.

    You can enter the speed in m/min or m/s: the equivalent value will be updated automatically.
    Simply fill in one of the two fields.




    System Interface

    (Mandatory choice)

    The interface defines how the CIS transfers images and control signals to the host system, e.g. PC, frame
    Grabber or PLC. This choice affects available bandwidth, cable length, integration architecture, and overall system performance.


    CameraLink Base

    Camera Link Base
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    CameraLink Full

    Camera Link Full
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    CoaXPress 1.1

    CoaXPress 1.1
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    CoaXPress 2.0

    CoaXPress 2.0
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    10 GigE

    10GigEthernet
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    2.5GigEthernet

    2.5GigEthernet
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    1.0GigEthernet

    1.0GigEthernet
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    USB 3.0

    USB 3.0
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    Image type

    Defines whether the CIS acquires a monochrome image, based on brightness alone, or an RGB color image, useful for distinguishing color differences between prints, inks, materials, or surfaces.

    Monochrome (Grayscale)

    Monochrome
    (Grayscale)

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    Color (RGB)

    Color
    (RGB)

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    Sensor architecture

    It defines the architecture of the CIS sensor, i.e. how the sensing lines are arranged on the chip.
    In single-line configuration the sensor acquires one line per exposure.
    In a tri-line configuration, it uses three separate lines, typically used for RGB color acquisition. This choice affects the amount of data to be transferred, the achievable speed, and the complexity of integration.

    Single-line

    Single-line
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    Tri-line

    Tri-line
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    To be defined

    To be defined
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    CIS working distance

    The various industrial CIS series differ primarily in working distance and depth of field. In this section, you can find the solution best suited to the mechanical and optical constraints of your application.

    PY Series
    WD: 8 mm
    DOF: +/- 1

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    PL Series
    WD: 14.8 mm
    DOF: +/- 1

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    PH Series
    WD: 17.2 mm
    DOF: +/- 2

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    PV Series
    WD: 29.3 mm
    DOF: +/- 2

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    PF Version
    WD: 48.4 mm
    DOF: +/- 2

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    Lighting setup

    The CIS lighting can be configured with integrated light, external light, backlight or special solutions such as
    Coaxial, depending on the material and the type of defect being detected. In the standard configurations considered by this configurator, the system can manage up to three lighting channels. The external lights can be synchronized with the line scanning, thus reducing heating and power consumption and maintaining high luminance even at high speeds.

    Integrated light

    Integrated light
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    Coaxial light

    Coaxial light
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    External integrated

    External integrated
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    External light

    External light
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    Without integrated light

    Without integrated light
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    External light configurations

    This section is dedicated to applications that require the use of external lighting. Depending on the material, surface, and
    Depending on the defect to be detected, the light can be configured with different illumination geometries, such as dark field, total reflection, or backlight. If your application only uses the CIS's integrated light, or does not have an integrated light, you can select the "Not applicable" option.

    • Dark field illumination:
      grazing light from the side, highlights scratches, engravings and surface defects because it creates shadows and reflections only on the reliefs.

    • Total reflection (or front bright field):
      Front light aligned with the sensor, for flat and printed surfaces: illuminates evenly and makes colors and text visible clearly.

    • Back light illumination (backlight):
      light placed behind the piece: the sensor sees the profile in silhouette and can measure holes, cuts, edges and transparencies.

    HLU (Standard Linear)

    HLU
    (Standard Linear)

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    MHLU (Slim)

    MHLU
    (Slim)

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    UHLU

    UHLU
    (Long-range compact version)

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    HCLU

    HCLU
    (High-power RGB)

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    SHLU (Superficie uniforme)

    SHLU
    (Homogeneous surface)

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    JHLU (Focused beam)

    JHLU
    (Focused beam)

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    XH3LU (45° incident light)

    XH3LU
    (45° incident light)

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    IHLU/IH2LU (Cross-directional lighting)

    IHLU/IH2LU
    (Cross-directional lighting)

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    Not applicable

    Not applicable
    (built-in light or no built-in light)

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    Spectrum of light

    This section defines the spectral configuration of the light. White light, single RGB/G/B channels, RGB, IR, and UV can be available. The choice of wavelength allows you to increase the useful contrast depending on the material, surface finish, and optical response of the defect or feature being inspected.

    White
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    Red, Green, Blue singles
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    UV
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    RGB
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    IR
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    Project Description

    NOTE
    The selected configuration represents a preliminary technical basis. Our team will review it based on the application and project constraints to propose the most suitable solution.









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    Summary and Personal Data

    Summary of Choices: