CIS for AOI / Industrial

Material to scan

Select the material to be inspected. This choice helps to correctly orient optics, illumination, resolution and
CIS configuration.

Defect or characteristic to be detected

Select the type of anomaly or feature you need to check. This choice helps you correctly define the resolution, illumination, working distance, and CIS configuration.

Usable width to scan

DPI (Dots Per Inch)

CIS Speed

System Interface

The interface defines how the CIS transfers images and control signals to the host system, e.g. PC, frame
Grabber or PLC. This choice affects available bandwidth, cable length, integration architecture, and overall system performance.

Image type

Defines whether the CIS acquires a monochrome image, based on brightness alone, or an RGB color image, useful for distinguishing color differences between prints, inks, materials, or surfaces.

Sensor architecture

It defines the architecture of the CIS sensor, i.e. how the sensing lines are arranged on the chip.
In single-line configuration the sensor acquires one line per exposure.
In a tri-line configuration, it uses three separate lines, typically used for RGB color acquisition. This choice affects the amount of data to be transferred, the achievable speed, and the complexity of integration.

CIS working distance

Lighting setup

The CIS lighting can be configured with integrated light, external light, backlight or special solutions such as
Coaxial, depending on the material and the type of defect being detected. In the standard configurations considered by this configurator, the system can manage up to three lighting channels. The external lights can be synchronized with the line scanning, thus reducing heating and power consumption and maintaining high luminance even at high speeds.

External light configurations

This section is dedicated to applications that require the use of external lighting. Depending on the material, surface, and
Depending on the defect to be detected, the light can be configured with different illumination geometries, such as dark field, total reflection, or backlight. If your application only uses the CIS's integrated light, or does not have an integrated light, you can select the "Not applicable" option.

• Dark field illumination:
  grazing light from the side, highlights scratches, engravings and surface defects because it creates shadows and reflections only on the reliefs.

• Total reflection (or front bright field):
  Front light aligned with the sensor, for flat and printed surfaces: illuminates evenly and makes colors and text visible clearly.

• Back light illumination (backlight):
  light placed behind the piece: the sensor sees the profile in silhouette and can measure holes, cuts, edges and transparencies.

Spectrum of light

Project Description

NOTE
The selected configuration represents a preliminary technical basis. Our team will review it based on the application and project constraints to propose the most suitable solution.

Project Description *

Estimated annual requirement

Mechanical Constraints/Additional Notes.

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